GB 50057-2010 第6.3.3条
| Equipotential bonding for information equipment within the hotel (such as the ELV equipment room, fire control room, and security monitoring room) shall adopt a star (S-type) or mesh (M-type) structure. When the S-type is adopted, the cross-sectional area of the connecting line between the equipment enclosure and the equipotential bonding bar shall be not less than 6 mm² copper conductor; when the M-type is adopted, the mesh size should not be greater than 2 m × 2 m, and the cross-sectional area of the connecting line shall be not less than 16 mm² copper conductor.